RTP-800S 

DESCRIPTION

The RTP-800S system is an advanced, stand-alone rapid thermal processing system with multi-gas capabilities. The system processes wafers up to 8" in diameter. The integrated process control system features real time graphics, recipe management, data acquisition and display and has a comprehensive diagnostic function. 

Click here for photo image of RTP-800S

PROCESSES

  • Contact alloying
  • Implant activation
  • Silicide formation
  • Nitridation of metals
  • Oxidation
  • Glass reflow

 

LEADING PARTICULARS

Wafer Size: up to 8"
Temperature Range: 250-1250 deg. C
Ramp Rate: 0-150 deg. C/sec.
Temperature Control Repeatability: +/-2 deg.C
Temperature Accuracy: +/-2 deg. C

 

FEATURES

  • Quartz processing chamber
  • Quartz tray
  • Four-layer Tungsten Halogen Lamp Array Heating
  • Zone Control with unique lamp arrangement ensures highly uniform heating of up to 8" Silicon Wafers or 6” GaAs Wafers with 8" O.D. Susceptor
  • Closed-loop temperature control algorithim with temperature control stability of +/-2  deg. C from set point.
  • Extended Range Pyrometer Plus (ERP+) internally cooled pyrometer for extended temperature range from 350 – 1250 Degrees C
  • Pyrometer auto-calibration feature provides accurate temperature measurement.
  • An impressive list of software features.
  • Up to 10 channels MFC control.

 

TEMPERATURE CONTROL

The RTP-800S System features a closed-loop temperature control algorithim with a temperature control stability of from +/-2 deg. C from set point. This feature greatly simplifies programming complex multi-step cycles. Software diagnostics are provided to monitor each lamp and compensate for lamp aging effects

 

TEMPERATURE MEASUREMENT

The temperature measurement techniques available for the RTP-800S system are thermocouple and pyrometer. The type K thermocouple is useful for low-temperature processing and calibrating the pyrometer.  The Extended Range Pyrometer Plus (ERP+) internally cooled pyrometer can be used to measure wafer temperatures in the range of 350-1250 deg. C. (Actual range depends upon process, wafer type and system configuration.)

 

SOFTWARE

An integrated software package has been developed to control the RTP-800S System. The software modules interactively serve to integrate the various functions and operations of this system. Software features allow convenient recipe creation and editing. Process data may be collected during a run cycle and stored in a data file for later display and analysis. The process and recipe data files can be internally stored as DIF (Data Interchange Format) which can be imported into popular software packages such as Lotus 1-2-3, as a worksheet for display, plotting and further analysis.

 

SOFTWARE FEATURES

  • Real-Time Process Control
  • Real-Time Graphics Display
  • Real-Time Process Data Collection
  • Recipe Editor
  • Recipe Validation
  • Process Data File Management
  • Process Data File Display and Analysis
  • System Diagnostics
  • System Configuration Utilities

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