RTP-3000 Advanced Rapid Thermal Processing System 

for 300mm Wafers

RTP-3000   Advanced Rapid Thermal Processing System-shown configured for silicon wafers up to 300mm

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  • Cool and process wafers simultaneously
  • 300mm wafer handling
  • Windows-based user interface
  • Touch screen control
  • Dual-arm robot for safe handling of wafers
  • Up to six gas channels
  • Temperature range:
    250 deg. C - 1250 deg.C
  • Atmospheric processing